800 Watt Solar Panel

Remark: customized frame color and cable length available upon request

1.Advanced N-Type Bifacial HJT Technology

Leveraging 210mm wafers and half-cut cell design, this panel combines N-type bifacial HJT technology for superior light absorption and energy conversion efficiency. The 18BB (busbar) configuration with thin-slice cells reduces internal resistance and improves current collection.

2.Industry-Leading Power & Efficiency

With a maximum power output of 800W and module efficiency up to 24.39%, it delivers unmatched energy density. The innovative stencil printing process and silver-coated copper ribbons optimize conductive performance, ensuring minimal power loss.

3.4.1% Higher Front-Side Output Than TOPCon

Thanks to its HJT architecture and enhanced electron mobility, this panel outperforms TOPCon modules by 4.1% in front-side power generation, making it ideal for space-constrained installations.

4.Exceptional Durability & Reliability

Engineered with boron-free materials to eliminate B-O induced degradation (B0-LiD), it offers robust resistance to LeTID and PID. The low annual degradation rate (<0.3%) ensures long-term energy yield stability.

5.95% Bifaciality for Maximum Energy Harvest

The high bifaciality allows the panel to generate up to 95% of its front-side output from reflected light on the rear side, significantly boosting total energy production in ground-mounted and tracking systems.

STC (Standard Test Conditions): Irradiance 1000 W/㎡, Cell Temperature 25°C, Air Mass 1.5.

BSTC (Bifacial Standard Test Conditions): Front Side Irradiation 1000 W/㎡, Back Side Reflection Irradiation 135 W/㎡, Air Mass 1.5, Ambient Temperature 25°C.

1. Silicon Wafer Preparation

Material Selection: Uses 210mm N-type monocrystalline silicon wafers (low boron-oxygen content) to eliminate B-O induced degradation (B0-LiD).

Surface Texturing: Etching to create a micro-roughened surface for enhanced light absorption.

2. HJT Cell Manufacturing

Non-Si Layers Deposition:

a-Si Layers: Deposition of hydrogenated amorphous silicon (a-Si:H) on both sides of the wafer via plasma-enhanced chemical vapor deposition (PECVD). This forms the heterojunction structure for efficient charge separation.

TCO Coating: Transparent conductive oxide (TCO) layers (e.g., ITO or ZnO) applied by sputtering to reduce surface recombination and improve conductivity.

Metallization:

Screen Printing: Stencil printing of silver-coated copper paste for front-side electrodes (18BB busbars) to minimize resistance and improve current collection.

Back-Side Contacts: Laser ablation and metal plating for rear contacts.

3. Half-Cut Cell Processing

Laser Cutting: Wafers are split into half-cells to reduce internal resistance and improve shading tolerance.

Interconnection: Thin silver-coated copper ribbons connect half-cells in series/parallel, using soldering or conductive adhesive.

4. Module Assembly

Lamination:

Layers Stacking: Cells are sandwiched between front glass, EVA encapsulant, and backsheet (or dual glass for bifaciality).

Vacuum Lamination: High-temperature pressing (140–150°C) bonds layers together, ensuring hermetic sealing.

Frame & Junction Box: Aluminum frames and junction boxes with bypass diodes are added for mechanical support and electrical connections.

Testing & Quality Control

Electrical Testing: IV curve measurements to verify power output (up to 800W), efficiency (24.39%), and bifaciality (95%).

Reliability Tests:

Thermal Cycling: Accelerated aging to simulate temperature extremes.

Humidity-Freeze Testing: Exposure to high humidity and freezing conditions.

UV Resistance: UV light exposure to assess degradation.

Anti-PID/LeTID Validation: Testing under high voltage and thermal stress to confirm resistance to potential-induced degradation and light-induced degradation.

5.Key Advantages Built into the Process

Low-Temperature Process: HJT's <200°C manufacturing avoids thermal stress on silicon, reducing defects.

Silver-Coated Copper Ribbons: Cost-effective and high-conductivity solution for electrodes.

Dual-Glass Design: Enhances durability and bifacial light capture.

This integrated process ensures the module delivers high energy yield, long-term reliability, and superior performance compared to TOPCon or PERC technologies.

Jingsun has created a global intelligent logistics system to meet the transportation needs of 800W solar modules, combining advanced packaging technology and supply chain management to ensure that products are delivered to customers safely, efficiently and sustainably.

1. Global transportation network and multimodal transport

Dynamically plan the optimal route based on AI algorithm to reduce the number of transfers and transportation risks.

2. Intelligent packaging and safety protection

Adopt recyclable honeycomb carton + EPE foam lining, with edge reinforcement strips, pass ISTA 3E international transportation test to ensure that the modules are intact during falling and vibration.

3. Customized service

Provide temperature-controlled container transportation for high altitude and extremely cold/hot areas.

Provide unloading guidance and installation support at the photovoltaic power station project site.

Flexible payment: Support CIF, FOB, EXW and other trade terms to meet the needs of different customers.

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